Invention Grant
- Patent Title: Laser machining apparatus including guide laser
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Application No.: US15730093Application Date: 2017-10-11
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Publication No.: US10369716B2Publication Date: 2019-08-06
- Inventor: Ryusuke Miyata
- Applicant: FANUC CORPORATION
- Applicant Address: JP Yamanashi
- Assignee: FANUC CORPORATION
- Current Assignee: FANUC CORPORATION
- Current Assignee Address: JP Yamanashi
- Agency: Studebaker & Brackett PC
- Priority: JP2016-202834 20161014
- Main IPC: B26D5/00
- IPC: B26D5/00 ; B23K26/04 ; B23K26/38 ; B23K26/60

Abstract:
A laser machining apparatus capable of extending the life time of a guide laser is provided. A laser machining apparatus 1 includes a cutting head 2 that irradiates a machining laser light to a machining target W, a guide laser 5 that irradiates a visible guide light to the machining target W, and a power supply 6 that supplies electric power to the guide laser 5. The laser machining apparatus 1 further includes a controller 7 that performs control so that, before the machining laser light is irradiated from the cutting head 2 to the machining target W and laser cutting starts, electric power is supplied from the power supply 6 to the guide laser 5, and the guide light is irradiated from the guide laser 5 to the machining target W according to an output position of the machining laser light output from the cutting head 2 so that the output position of the machining laser light is ascertained. The controller 7 has a laser output setting unit 4 capable of adjusting an output of the guide light of the guide laser 5 within a range where the visibility of the guide light is secured when the guide light is output from the guide laser 5.
Public/Granted literature
- US20180104838A1 LASER MACHINING APPARATUS Public/Granted day:2018-04-19
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