Invention Grant
- Patent Title: Deposition of protective material at wafer level in front end for early stage particle and moisture protection
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Application No.: US15827057Application Date: 2017-11-30
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Publication No.: US10370244B2Publication Date: 2019-08-06
- Inventor: Florian Brandl , Manfred Fries , Franz-Peter Kalz
- Applicant: Infineon Technologies AG
- Applicant Address: DE
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE
- Agency: Design IP
- Main IPC: B81C1/00
- IPC: B81C1/00 ; B81B7/00 ; H01L23/04 ; H01L23/10 ; H01L21/50 ; B29C35/02
Abstract:
A semiconductor device and a method of manufacturing the same are provided such that a microelectromechanical systems (MEMS) element is protected at an early manufacturing stage. A method for protecting a MEMS element includes: providing at least one MEMS element, having a sensitive area, on a substrate; and depositing, prior to a package assembly process, a protective material over the sensitive area of the at least one MEMS element such that the sensitive area of at least one MEMS element is sealed from an external environment, where the protective material permits a sensor functionality of the at least one MEMS element.
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