Invention Grant
- Patent Title: Propylene homopolymer for stress-resistant molded article, composition containing the polymer, and stress-resistant molded articles obtained therefrom
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Application No.: US12448983Application Date: 2008-01-17
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Publication No.: US10370465B2Publication Date: 2019-08-06
- Inventor: Keita Itakura , Toshiyuki Ishii , Rikuo Onishi , Satoshi Hashizume
- Applicant: Keita Itakura , Toshiyuki Ishii , Rikuo Onishi , Satoshi Hashizume
- Applicant Address: JP Tokyo JP Tokyo
- Assignee: PRIME POLYMER CO., LTD.,MITSUI CHEMICALS, INC.
- Current Assignee: PRIME POLYMER CO., LTD.,MITSUI CHEMICALS, INC.
- Current Assignee Address: JP Tokyo JP Tokyo
- Agency: Foley & Lardner LLP
- Priority: JP2007-009387 20070118
- International Application: PCT/JP2008/050540 WO 20080117
- International Announcement: WO2008/088022 WO 20080724
- Main IPC: C08L23/12
- IPC: C08L23/12 ; C08F110/06 ; C08F4/659 ; C08K7/14 ; C08L23/16

Abstract:
Propylene polymers and propylene resin compositions containing the polymers are used as molded articles used under stress for a long period such as automotive parts, housing parts, home appliance parts and electric power tool parts. Stress-resistant molded articles of the invention are obtained from these materials. A propylene homopolymer (A) satisfies the following requirements (1) to (3), and a polypropylene resin composition contains the propylene homopolymer (A). (1) The ratio (Mw/Mn) of weight average molecular weight (Mw) to number average molecular weight (Mn) according to GPC is in the range of 1.2 to 3.5. (2) Mn is in the range of 35,000 to 400,000. (3) The content of components soluble in o-dichlorobenzene at 90° C. is not more than 4 wt %.
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