Invention Grant
- Patent Title: Polyamic acid resin and polyamideimide film
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Application No.: US15668970Application Date: 2017-08-04
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Publication No.: US10370496B2Publication Date: 2019-08-06
- Inventor: Sang Yoon Park , Hyeon Jeong Kim , Tae Sug Jang , Jin Hyung Park
- Applicant: SK INNOVATION CO., LTD.
- Applicant Address: KR Seoul
- Assignee: SK INNOVATION CO., LTD.
- Current Assignee: SK INNOVATION CO., LTD.
- Current Assignee Address: KR Seoul
- Agency: Hauptman Ham, LLP
- Priority: KR10-2016-0102526 20160811; KR10-2017-0079588 20170623
- Main IPC: C08G73/14
- IPC: C08G73/14 ; C08G73/10 ; C08J5/18 ; C09D179/08
Abstract:
Provided are a polyamic acid resin, a polyamideimide film, and a method for preparing the same. More specifically, provided are a polyamic acid resin derived from a combination of specific components, and a polyamideimide film capable of implementing high modulus and excellent optical properties.
Public/Granted literature
- US20180044476A1 POLYAMIC ACID RESIN AND POLYAMIDEIMIDE FILM Public/Granted day:2018-02-15
Information query
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