Invention Grant
- Patent Title: Resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed wiring board
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Application No.: US15118302Application Date: 2015-02-19
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Publication No.: US10370536B2Publication Date: 2019-08-06
- Inventor: Yoshitaka Ueno , Masataka Kudo , Michio Yaginuma
- Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
- Current Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
- Current Assignee Address: JP Tokyo
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JP2014-043504 20140306
- International Application: PCT/JP2015/054686 WO 20150219
- International Announcement: WO2015/133292 WO 20150911
- Main IPC: B32B15/08
- IPC: B32B15/08 ; B32B15/082 ; B32B15/092 ; B32B27/18 ; B32B27/28 ; B32B27/30 ; B32B27/38 ; H05K1/03 ; C08J5/24 ; C08L63/00 ; C08L63/02 ; C08L63/04 ; C08L71/12 ; C08K5/5399 ; B32B27/20 ; B32B5/02 ; B32B27/06 ; C08K3/36 ; C08K7/18 ; C08L79/04 ; C08G73/06
Abstract:
A resin composition comprising a polyphenylene ether (A) having a number average molecular weight of 500 to 5000; a cyclophosphazene compound (B); a non-halogen-based epoxy resin (C); a cyanate compound (D); and a filler (E).
Public/Granted literature
- US20170158854A1 RESIN COMPOSITION, PREPREG, RESIN SHEET, METAL-FOIL-CLAD LAMINATED PLATE, AND PRINTED WIRING BOARD Public/Granted day:2017-06-08
Information query
