The present invention relates generally to wall repair compounds such as joint compounds, spackling compounds, and the like used to repair imperfections in walls or fill joints between adjacent wallboard panels. Particularly, the present invention relates to such a wall repair compound comprising a dust reducing additive that reduces the quantity of airborne dust generated when the hardened compound is sanded. The dust reducing additive also imparts adhesion to the wall repair compounds to which it is added, for example to a joint compound. The dust reducing additive comprises microcrystalline-wax based emulsion.