Invention Grant
- Patent Title: Hot melt adhesive
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Application No.: US15609455Application Date: 2017-05-31
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Publication No.: US10370567B2Publication Date: 2019-08-06
- Inventor: Masahiro Moriguchi , Shigekazu Saito
- Applicant: HENKEL AG & CO. KGAA
- Applicant Address: DE Duesseldorf
- Assignee: HENKEL AG & CO. KGAA
- Current Assignee: HENKEL AG & CO. KGAA
- Current Assignee Address: DE Duesseldorf
- Agent Sun Hee Lehmann
- Priority: JP2011-203063 20110916
- Main IPC: C09J123/12
- IPC: C09J123/12 ; C09J11/06 ; C09J123/08 ; C08L23/08 ; C09J7/35

Abstract:
The present invention provides a hot melt adhesive for high-speed coating and spiral coating at low temperature. The hot melt adhesive has excellent adhesion to polyethylene and nonwoven fabric, and is suitable for disposable products. The hot melt adhesive comprises: (A) a propylene homopolymer having a melting point of 100° C. or lower which is obtainable by polymerizing propylene using a metallocene catalyst; and (B) an ethylene-based copolymer.
Public/Granted literature
- US20170260430A1 HOT MELT ADHESIVE Public/Granted day:2017-09-14
Information query
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