Invention Grant
- Patent Title: Method for forming thermally conductive thermal radical cure silicone compositions
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Application No.: US14766774Application Date: 2014-02-10
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Publication No.: US10370574B2Publication Date: 2019-08-06
- Inventor: Arianne Tan , Yin Tang , James Tonge
- Applicant: Dow Silicones Corporation
- Applicant Address: US MI Midland
- Assignee: Dow Silicones Corporation
- Current Assignee: Dow Silicones Corporation
- Current Assignee Address: US MI Midland
- International Application: PCT/US2014/015578 WO 20140210
- International Announcement: WO2014/124367 WO 20140814
- Main IPC: C09K5/14
- IPC: C09K5/14 ; C09J183/06 ; C09J183/14 ; C08L83/06 ; C08L83/14 ; C09D183/04 ; C08G77/12 ; C08G77/14 ; C08G77/20 ; C08L83/00 ; C08K3/22
Abstract:
A method for forming a thermally conductive thermal radical cure silicone composition comprising (I) a clustered functional polyorganopolysiloxane; optionally (II) a silicone reactive diluent, (III) a filler comprising a thermally conductive filler, (III′) a filler treating agent, and (IV) a radical initiator is provided. In this method, the clustered functional polyorganosiloxane (I) and the optional silicone reactive diluent (II) are premade prior to their addition to respective components (III), (III′) and (IV).
Public/Granted literature
- US20150376488A1 Method For Forming Thermally Conductive Thermal Radical Cure Silicone Compositions Public/Granted day:2015-12-31
Information query
