Invention Grant
- Patent Title: Thin substrate processing device
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Application No.: US14648226Application Date: 2014-01-28
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Publication No.: US10370757B2Publication Date: 2019-08-06
- Inventor: Tetsushi Fujinaga , Masahiro Matsumoto , Makoto Arai , Eriko Mase , Harunori Iwai , Koji Takahashi , Atsuhito Ihori
- Applicant: ULVAC, Inc.
- Applicant Address: JP Chigasaki-shi
- Assignee: ULVAC, INC.
- Current Assignee: ULVAC, INC.
- Current Assignee Address: JP Chigasaki-shi
- Agency: Schwegman Lundberg & Woessner, P.A.
- Priority: JP2013-019767 20130204; JP2013-019768 20130204
- International Application: PCT/JP2014/051856 WO 20140128
- International Announcement: WO2014/119580 WO 20140807
- Main IPC: H01J37/34
- IPC: H01J37/34 ; C23C14/54 ; C23C14/50 ; H01L21/67 ; H01L21/683 ; C23C14/56 ; C23C14/34 ; H01J37/32
Abstract:
A thin substrate processing device include a substrate processing unit configured to process a thin substrate, and a cooling unit configured to cool the thin substrate when the substrate processing unit is processing the thin substrate.
Public/Granted literature
- US20160376697A1 THIN SUBSTRATE PROCESSING DEVICE Public/Granted day:2016-12-29
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