- Patent Title: Silicon carbide epitaxial wafer manufacturing method, silicon carbide semiconductor device manufacturing method and silicon carbide epitaxial wafer manufacturing apparatus
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Application No.: US15372949Application Date: 2016-12-08
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Publication No.: US10370775B2Publication Date: 2019-08-06
- Inventor: Akihito Ohno , Kenichi Hamano , Takashi Kanazawa
- Applicant: Mitsubishi Electric Corporation
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Studebaker & Brackett PC
- Priority: JP2016-089735 20160427
- Main IPC: C30B29/36
- IPC: C30B29/36 ; C23C16/32 ; C30B25/14 ; C30B25/20 ; H01L21/02

Abstract:
A silicon carbide epitaxial wafer manufacturing method includes: a stabilization step of nitriding, oxidizing or oxynitriding and stabilizing silicon carbide attached to an inner wall surface of a growth furnace; after the stabilization step, a bringing step of bringing a substrate in the growth furnace; and after the bringing step, a growth step of epitaxially growing a silicon carbide epitaxial layer on the substrate by supplying a process gas into the growth furnace to manufacture a silicon carbide epitaxial wafer.
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