Invention Grant
- Patent Title: Layer system with a structured substrate surface and production process
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Application No.: US14354571Application Date: 2012-09-14
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Publication No.: US10371004B2Publication Date: 2019-08-06
- Inventor: Alessandro Casu , Oliver Lusebrink
- Applicant: Alessandro Casu , Oliver Lusebrink
- Applicant Address: DE Munich
- Assignee: SIEMENS AKTIENGESELLSCHAFT
- Current Assignee: SIEMENS AKTIENGESELLSCHAFT
- Current Assignee Address: DE Munich
- Agency: Beusse Wolter Sanks & Maire
- Priority: EP11188983 20111114
- International Application: PCT/EP2012/068055 WO 20120914
- International Announcement: WO2013/072092 WO 20130523
- Main IPC: F01D25/00
- IPC: F01D25/00 ; F01D5/28 ; C23C4/00 ; C23C28/00

Abstract:
A layer system is provided having at least two layers, an inner layer on a boundary surface of a substrate, wherein the inner layer has a certain roughness in a region of the surface to an outer layer due to a coating processes, wherein a roughness of the boundary surface of the substrate is set in a targeted manner, or the boundary surface is machined, after it has been produced, such that the roughness of the boundary surface of the substrate has peaks and troughs that are at least 20% greater than the roughness of the interface if peaks and troughs were not to be present. As a result of the structured surface of the substrate, this roughness becomes positioned on an interface of the layers located above, and the adhesion of the layers to one another is thereby improved.
Public/Granted literature
- US20140302282A1 LAYER SYSTEM WITH A STRUCTURED SUBSTRATE SURFACE AND PRODUCTION PROCESS Public/Granted day:2014-10-09
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