Invention Grant
- Patent Title: Sealing of optical module with O-ring and liquid resin
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Application No.: US14796890Application Date: 2015-07-10
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Publication No.: US10371369B2Publication Date: 2019-08-06
- Inventor: Yukio Sakigawa , Masayuki Okamura , Hiroaki Furuichi , Hiroshi Ogasawara , Kenji Watabe , Fumihito Ichikawa , Tatsuya Yamasaki
- Applicant: HITACHI-LG DATA STORAGE, INC.
- Applicant Address: JP Tokyo
- Assignee: HITACHI-LG DATA STORAGE, INC.
- Current Assignee: HITACHI-LG DATA STORAGE, INC.
- Current Assignee Address: JP Tokyo
- Agency: Miles & Stockbridge PC
- Priority: JP2014-157554 20140801
- Main IPC: F21V31/00
- IPC: F21V31/00 ; F21V29/54 ; G03B21/20 ; G03B21/14 ; G02B27/01 ; G03B17/08

Abstract:
An optical module having a high-moisture-proof package structure in which dew condensation does not occur is provided.An optical module includes optical components including a light source, a pedestal on which the optical components are mounted, a cover which is combined to the pedestal to seal the optical components, and an emitting window disposed in the cover to take light from the light source outside. The pedestal and the cover are sealed with an O ring and a liquid seal material such that a compression direction of the O ring and a compression direction of the liquid seal material are almost perpendicular to each other.
Public/Granted literature
- US20160033122A1 OPTICAL MODULE AND METHOD OF MAKING THE SAME Public/Granted day:2016-02-04
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