Invention Grant
- Patent Title: Multi-layered counterflow expanding microchannel cooling architecture and system thereof
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Application No.: US15290748Application Date: 2016-10-11
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Publication No.: US10371461B2Publication Date: 2019-08-06
- Inventor: Timothy Joseph Chainer , Pritish Ranjan Parida , Fanghao Yang
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Amin, Turocy & Watson, LLP
- Main IPC: F28D1/03
- IPC: F28D1/03 ; F28F3/08 ; F28F3/12 ; H05K7/20 ; F28D15/00 ; F28D15/02 ; F28D21/00 ; H01L23/373 ; H01L23/427

Abstract:
Devices that have integrated cooling structures for counterflow, two-phase cooling and systems thereof are provided. In one example, a first structure can comprise a first cooling channel. The first cooling channel can have a first value of width that increases as the first cooling channel extends from a first side of a heat transfer area towards a second side of the heat transfer area. Also, a second structure can comprise a second cooing channel. The second cooling channel can have a second value of width that increases as the second cooling channel extends from the second side of the heat transfer area towards the first side of the heat transfer area.
Public/Granted literature
- US20180100710A1 MULTI-LAYERED COUNTERFLOW EXPANDING MICROCHANNEL COOLING ARCHITECTURE AND SYSTEM THEREOF Public/Granted day:2018-04-12
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