Invention Grant
- Patent Title: Co-extruded microchannel heat pipes
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Application No.: US13308519Application Date: 2011-11-30
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Publication No.: US10371468B2Publication Date: 2019-08-06
- Inventor: David Eric Schwartz , Ranjeet Balakrishna Rao
- Applicant: David Eric Schwartz , Ranjeet Balakrishna Rao
- Applicant Address: US CA Palo Alto
- Assignee: Palo Alto Research Center Incorporated
- Current Assignee: Palo Alto Research Center Incorporated
- Current Assignee Address: US CA Palo Alto
- Agency: Bever, Hoffman & Harms, LLP
- Main IPC: F28D15/04
- IPC: F28D15/04 ; F28F21/08 ; F28F21/06 ; F28D15/02 ; H01L23/427 ; B23P15/26

Abstract:
A microchannel heat pipe formed on a substrate surface using co-extruding a primary material and a secondary material such that the primary material forms side wall portions that are spaced apart by the secondary material, and an upper wall portion is formed across the upper ends of the side walls to form a composite structure. After the primary material hardens, the secondary material is removed, whereby the hardened primary material forms a pipe body having an elongated central channel defined between opposing end openings. A working fluid is then inserted into the elongated central channel, and sealing structures are then formed over both end openings to encapsulate the working fluid.
Public/Granted literature
- US20130133863A1 Co-Extruded Microchannel Heat Pipes Public/Granted day:2013-05-30
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