Invention Grant
- Patent Title: Shape measurement method and shape measurement device
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Application No.: US15775073Application Date: 2016-10-05
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Publication No.: US10371503B2Publication Date: 2019-08-06
- Inventor: Hidehisa Hashizume , Shunsuke Takami , Norihisa Harano
- Applicant: KOBELCO RESEARCH INSTITUTE, INC.
- Applicant Address: JP Kobe-shi
- Assignee: KOBELCO RESEARCH INSTITUTE, INC.
- Current Assignee: KOBELCO RESEARCH INSTITUTE, INC.
- Current Assignee Address: JP Kobe-shi
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2015-221281 20151111
- International Application: PCT/JP2016/079594 WO 20161005
- International Announcement: WO2017/081959 WO 20170518
- Main IPC: G01B11/06
- IPC: G01B11/06 ; G01B11/24 ; G06T7/60 ; G01N21/95
Abstract:
A measurement unit measures a cross-sectional shape of an edge part of a semiconductor wafer. The measurement unit measures a cross-sectional shape of an edge part of a support member. The measurement unit measures a cross-sectional shape of an edge part of a laminated wafer. An analysis unit calculates a thickness of an adhesive agent by subtracting a thickness of the semiconductor wafer and a thickness of the support member from a thickness of the laminated wafer.
Public/Granted literature
- US20180321027A1 SHAPE MEASUREMENT METHOD AND SHAPE MEASUREMENT DEVICE Public/Granted day:2018-11-08
Information query
