Invention Grant
- Patent Title: Temperature sensor assembly for swirling flows
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Application No.: US15613976Application Date: 2017-06-05
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Publication No.: US10371585B2Publication Date: 2019-08-06
- Inventor: Chiong Siew Tan , John Patrick Parsons , Dennis Michael Clapperton
- Applicant: General Electric Company
- Applicant Address: US NY Schenectady
- Assignee: General Electric Company
- Current Assignee: General Electric Company
- Current Assignee Address: US NY Schenectady
- Agency: Dority & Manning, P.A.
- Main IPC: G01K13/02
- IPC: G01K13/02 ; G01K1/08 ; G01K1/14

Abstract:
A temperature sensor assembly includes a bluff body, and a first member spaced apart from the bluff body that defines a first flow channel in relation to the bluff body. The temperature sensor assembly also includes a second member spaced apart from the bluff body that defines a second flow channel in relation to the bluff body. The first member and the second member further define a third flow channel in fluid communication with and downstream of the first flow channel and the second flow channel. The temperature sensor assembly also includes a sensor element spaced apart from the bluff body and disposed at least partially within the third flow channel.
Public/Granted literature
- US20180348068A1 TEMPERATURE SENSOR ASSEMBLY FOR SWIRLING FLOWS Public/Granted day:2018-12-06
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