Invention Grant
- Patent Title: Heated temperature sensor assembly
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Application No.: US15614031Application Date: 2017-06-05
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Publication No.: US10371586B2Publication Date: 2019-08-06
- Inventor: Chiong Siew Tan
- Applicant: General Electric Company
- Applicant Address: US NY Schenectady
- Assignee: General Electric Company
- Current Assignee: General Electric Company
- Current Assignee Address: US NY Schenectady
- Agency: Dority & Manning, P.A.
- Main IPC: G01K13/02
- IPC: G01K13/02 ; G01K1/08

Abstract:
A temperature sensor assembly includes a body configured to receive a heated flow of air therein. The body, in turn, includes a leading surface in thermal communication with the heated flow of air, a first concave surface including a first plurality of vents, a second concave surface including a second plurality of vents, and an air injector disposed within the body. The air injector is configured to apply a suction pressure to the first plurality of vents and to the second plurality of vents.
Public/Granted literature
- US20180348069A1 HEATED TEMPERATURE SENSOR ASSEMBLY Public/Granted day:2018-12-06
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