Invention Grant
- Patent Title: Multi-processor device
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Application No.: US15415079Application Date: 2017-01-25
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Publication No.: US10372654B2Publication Date: 2019-08-06
- Inventor: Koichi Ishimi
- Applicant: Renesas Electronics Corporation
- Applicant Address: JP Tokyo
- Assignee: Renesas Electronics Corporation
- Current Assignee: Renesas Electronics Corporation
- Current Assignee Address: JP Tokyo
- Agency: Shapiro, Gabor and Rosenberger, PLLC
- Priority: JP2007-011367 20070122
- Main IPC: G06F1/08
- IPC: G06F1/08 ; G06F9/38 ; G11C7/10 ; G06F13/40 ; G06F13/42 ; G06F15/80 ; G06F1/3293

Abstract:
The present invention intends to provide a high-performance multi-processor device in which independent buses and external bus interfaces are provided for each group of processors of different architectures, if a single chip includes a plurality of multi-processor groups. A multi-processor device of the present invention comprises a plurality of processors including first and second groups of processors of different architectures such as CPUs, SIMD type super-parallel processors, and DSPs, a first bus which is a CPU bus to which the first processor group is coupled, a second bus which is an internal peripheral bus to which the second processor group is coupled, independent of the first bus, a first external bus interface to which the first bus is coupled, and a second external bus interface to which the second bus is coupled, over a single semiconductor chip.
Public/Granted literature
- US20170132167A1 MULTI-PROCESSOR DEVICE Public/Granted day:2017-05-11
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