Invention Grant
- Patent Title: Method of pattern transfer
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Application No.: US15489842Application Date: 2017-04-18
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Publication No.: US10373827B2Publication Date: 2019-08-06
- Inventor: En-Chiuan Liou , Yu-Cheng Tung
- Applicant: UNITED MICROELECTRONICS CORP.
- Applicant Address: TW Hsinchu
- Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee Address: TW Hsinchu
- Agency: WPAT, PC
- Main IPC: H01L21/033
- IPC: H01L21/033 ; H01L21/762 ; H01L29/66 ; H01L21/308

Abstract:
A method of pattern transfer is provided, comprising: providing a target layer; forming a first pattern above the target layer; forming a second pattern (such as spacer loops) above the target layer and above the first pattern, wherein one closed end of the second pattern partially overlaps with the first pattern; and transferring the second pattern to the target layer, wherein the first pattern stops transferring pattern of the closed end of the second pattern to the target layer.
Public/Granted literature
- US20180301336A1 METHOD OF PATTERN TRANSFER Public/Granted day:2018-10-18
Information query
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