Invention Grant
- Patent Title: Semiconductor device and method for manufacturing the same
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Application No.: US15056013Application Date: 2016-02-29
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Publication No.: US10373833B2Publication Date: 2019-08-06
- Inventor: Aya Shindome , Masahiko Kuraguchi , Hisashi Saito , Shigeto Fukatsu , Miki Yumoto , Yosuke Kajiwara
- Applicant: Kabushiki Kaisha Toshiba
- Applicant Address: JP Minato-ku
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Minato-ku
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2015-060251 20150324
- Main IPC: H01L29/20
- IPC: H01L29/20 ; H01L21/265 ; H01L29/423 ; H01L21/76 ; H01L29/778 ; H01L29/417

Abstract:
A semiconductor device of an embodiment includes a first GaN-based semiconductor layer, a second GaN-based semiconductor layer provided on the first GaN-based semiconductor layer and having a larger bandgap than the first GaN-based semiconductor layer, a source electrode provided on the second GaN-based semiconductor layer, a drain electrode provided on the second GaN-based semiconductor layer, a recess provided between the source electrode and the drain electrode in the second GaN-based semiconductor layer, a gate insulating film provided on a surface of the recess, and a gate electrode provided on the gate insulating film and having an end portion in a gate width direction, located in the recess.
Public/Granted literature
- US20160284831A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2016-09-29
Information query
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