Invention Grant
- Patent Title: Method for manufacturing a metal gate
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Application No.: US15944800Application Date: 2018-04-04
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Publication No.: US10373834B2Publication Date: 2019-08-06
- Inventor: Qiuming Huang
- Applicant: Shanghai Huali Microelectronics Corporation
- Applicant Address: CN Shanghai
- Assignee: Shaghai Huali Microelectronics Corporation
- Current Assignee: Shaghai Huali Microelectronics Corporation
- Current Assignee Address: CN Shanghai
- Agency: Kilpatrick Townsend & Stockton LLP
- Priority: CN201711386290 20171220
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L21/28 ; H01L29/40 ; H01L29/423 ; H01L29/78

Abstract:
The present disclosure provides a semiconductor structure of a metal gate and a manufacturing method therefor. The manufacturing method includes providing a semiconductor substrate; uniformly depositing a first hard mask layer on the semiconductor substrate, corresponding to a region where the metal gate is located, patterning and etching the first hard mask layer to form a recess, forming a sloping sidewall on a sidewall of the recess, the sloping sidewall and an upper surface of the substrate forming a groove structure, with the size of an upper part of the groove structure being larger than that of a lower part thereof, and forming a metal gate in the groove structure; and removing the first hard mask layer.
Public/Granted literature
- US20190189451A1 SEMICONDUCTOR STRUCTURE WITH METAL GATE, AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2019-06-20
Information query
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