Invention Grant
- Patent Title: Electronic device and method of manufacturing the same
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Application No.: US16079128Application Date: 2017-03-24
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Publication No.: US10373889B2Publication Date: 2019-08-06
- Inventor: Masanori Ooshima , Eiji Hayashi
- Applicant: DENSO CORPORATION
- Applicant Address: JP Kariya
- Assignee: DENSO CORPORATION
- Current Assignee: DENSO CORPORATION
- Current Assignee Address: JP Kariya
- Agency: Posz Law Group, PLC
- Priority: JP2016-080578 20160413
- International Application: PCT/JP2017/011948 WO 20170324
- International Announcement: WO2017/179394 WO 20171019
- Main IPC: H01L21/56
- IPC: H01L21/56 ; H01L25/065 ; G01N29/04 ; H01L21/48 ; H01L23/00 ; H01L23/28 ; H01L23/29 ; H01L23/31 ; H01L23/48 ; H01L23/50 ; H01L25/07 ; H01L25/18 ; H01L23/495

Abstract:
In an electronic device including an electronic component, a sealing resin body, a first member having at least a portion located in the sealing resin body, and a second member connected to the first member via a solder in the sealing resin body, the first member includes a base material formed of a metal material and a coated film at least on a surface of the base material which is adjacent to a back surface of the first member opposite to a facing surface of the first member facing the second member. The coated film includes a metal thin film on a surface of the base material and an uneven oxide film on the metal thin film and made of an oxide of a same metal as a main component of the metal thin film.
Public/Granted literature
- US20190057921A1 ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2019-02-21
Information query
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