Invention Grant
- Patent Title: Package with passive devices and method of forming the same
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Application No.: US15823110Application Date: 2017-11-27
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Publication No.: US10373923B2Publication Date: 2019-08-06
- Inventor: Shuo-Mao Chen , Der-Chyang Yeh , Li-Hsien Huang
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/31 ; H01L23/522 ; H01L23/525 ; H01L21/56 ; H01L23/538 ; H01L21/768
Abstract:
An embodiment is a device comprising a substrate, a metal pad over the substrate, and a passivation layer comprising a portion over the metal pad. The device further comprises a metal pillar over and electrically coupled to the metal pad, and a passive device comprising a first portion at a same level as the metal pillar, wherein the first portion of the passive device is formed of a same material as the metal pillar.
Public/Granted literature
- US20180082966A1 Package with Passive Devices and Method of Forming the Same Public/Granted day:2018-03-22
Information query
IPC分类:
