Invention Grant
- Patent Title: Semiconductor package structure and method of manufacturing the same
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Application No.: US15441901Application Date: 2017-02-24
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Publication No.: US10373931B2Publication Date: 2019-08-06
- Inventor: Jeng-Nan Hung , Chun-Hui Yu , Kuo-Chung Yee , Yi-Da Tsai , Wei-Hung Lin , Ming-Da Cheng , Ching-Hua Hsieh
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee Address: TW Hsinchu
- Agency: WPAT, P.C., Intellectual Property Attorneys
- Agent Anthony King
- Main IPC: H01L21/56
- IPC: H01L21/56 ; H01L25/065 ; H01L23/31 ; H01L23/00 ; H01L25/00 ; H01L23/29
Abstract:
A method of manufacturing a semiconductor package structure is provided. A stacked structure formed over the carrier substrate is provided, wherein the stacked structure has a channel with an opening. The stacked structure is immersed into a fluidic molding material to render the fluidic molding material flow into the channel through the openings.
Public/Granted literature
- US20180151538A1 SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2018-05-31
Information query
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