Invention Grant
- Patent Title: Package-on-package structures and methods for forming the same
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Application No.: US15912807Application Date: 2018-03-06
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Publication No.: US10373941B2Publication Date: 2019-08-06
- Inventor: Kuei-Wei Huang , Chih-Wei Lin , Hsiu-Jen Lin , Wei-Hung Lin , Ming-Da Cheng , Chung-Shi Liu
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: H01L23/02
- IPC: H01L23/02 ; H01L25/00 ; H01L25/07 ; H01L25/10 ; H01L23/498 ; H01L21/48 ; H01L21/56 ; H01L23/14 ; H01L23/00 ; H01L21/60
Abstract:
A package includes a package component, which further includes a top surface and a metal pad at the top surface of the package component. The package further includes a non-reflowable electrical connector over and bonded to the metal pad, and a molding material over the package component. The non-reflowable electrical connector is molded in the molding material and in contact with the molding material. The non-reflowable electrical connector has a top surface lower than a top surface of the molding compound.
Public/Granted literature
- US20180197847A1 Package-on-Package Structures and Methods for Forming the Same Public/Granted day:2018-07-12
Information query
IPC分类:
