Invention Grant
- Patent Title: Method of fabricating a flexible substrate and the flexible substrate fabricated thereby
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Application No.: US15812231Application Date: 2017-11-14
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Publication No.: US10374093B2Publication Date: 2019-08-06
- Inventor: Doo-Hee Cho , Young Sam Park , Chunwon Byun , Byoung Gon Yu , Jonghee Lee , Hyunkoo Lee , Nam Sung Cho
- Applicant: Electronics and Telecommunications Research Institute
- Applicant Address: KR Daejeon
- Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Current Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Current Assignee Address: KR Daejeon
- Agency: Rabin & Berdo, P.C.
- Priority: KR10-2016-0166988 20161208; KR10-2017-0055380 20170428
- Main IPC: H01L29/76
- IPC: H01L29/76 ; H01L29/786 ; H01L51/00 ; H01L21/288 ; H01L21/02 ; H01L51/10 ; H01L29/423 ; H01L21/683 ; H01L51/05 ; H01L29/66

Abstract:
Embodiments of the inventive concepts provide a method of fabricating a flexible substrate and the flexible substrate fabricated thereby. The method includes printing a gate catalyst pattern on a separation layer, forming a gate plating pattern on the gate catalyst pattern, forming a gate insulating layer on the gate plating pattern, printing a source catalyst pattern and a drain catalyst pattern spaced apart from each other on the gate insulating layer, and forming a source plating pattern and a drain plating pattern on the source catalyst pattern and the drain catalyst pattern, respectively.
Public/Granted literature
- US20180166583A1 METHOD OF FABRICATING A FLEXIBLE SUBSTRATE AND THE FLEXIBLE SUBSTRATE FABRICATED THEREBY Public/Granted day:2018-06-14
Information query
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