Invention Grant
- Patent Title: Light-emitting device package
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Application No.: US15527589Application Date: 2015-11-04
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Publication No.: US10374135B2Publication Date: 2019-08-06
- Inventor: Keal Doo Moon , Sung Joo Oh
- Applicant: LG INNOTEK CO., LTD.
- Applicant Address: KR Seoul
- Assignee: LG INNOTEK CO., LTD.
- Current Assignee: LG INNOTEK CO., LTD.
- Current Assignee Address: KR Seoul
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: KR10-2014-0160623 20141118
- International Application: PCT/KR2015/011738 WO 20151104
- International Announcement: WO2016/080676 WO 20160526
- Main IPC: H01L33/62
- IPC: H01L33/62 ; H01L27/15 ; H01L33/54 ; H01L23/00

Abstract:
An embodiment provides a light emitting device package comprising: a package body; a first lead frame and a second lead frame, of which at least a part of each is inserted into the package body; and a light emitting device electrically flip bonded to the first lead frame and to the second lead frame, wherein the package body forms an electrode separation line between the first lead frame and the second lead frame, and the electrode separation line has at least two curved portions.
Public/Granted literature
- US20190157531A1 LIGHT-EMITTING DEVICE PACKAGE Public/Granted day:2019-05-23
Information query
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