Invention Grant
- Patent Title: Electronic unit attaching structure
-
Application No.: US16046326Application Date: 2018-07-26
-
Publication No.: US10374370B2Publication Date: 2019-08-06
- Inventor: Takuya Nakagawa , Koki Sato
- Applicant: Yazaki Corporation
- Applicant Address: JP Minato-ku, Tokyo
- Assignee: YAZAKI CORPORATION
- Current Assignee: YAZAKI CORPORATION
- Current Assignee Address: JP Minato-ku, Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2017-153464 20170808
- Main IPC: H01R13/518
- IPC: H01R13/518 ; H01R13/73 ; H01R27/02 ; H01H85/00 ; B60R16/023 ; H01R13/193 ; H01R13/631 ; H01R13/627

Abstract:
An electronic unit attaching structure includes an electronic unit (30) having a plurality of connector connection portions (33, 34) and an electronic unit attachment (20) having a plurality of connectors (C1, C2) correspond to the plurality of the connector connection portions. The electronic unit attaching structure is configured to allow first connection and second connection in this order when the electronic unit (30) is attached to the electronic unit attachment (20). The first connection is a connection of first part (C2) of the plurality of the connectors with first part (34) of the plurality of the connector connection portions. The second connection is a connection of second part (C1) of the plurality of the connectors with second part (33) of the plurality of the connector connection portions.
Public/Granted literature
- US20190052028A1 ELECTRONIC UNIT ATTACHING STRUCTURE Public/Granted day:2019-02-14
Information query