Invention Grant
- Patent Title: High power cavity package for light emitters
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Application No.: US15809733Application Date: 2017-11-10
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Publication No.: US10374387B2Publication Date: 2019-08-06
- Inventor: Brent Stapleton , Pritha Khurana , Nathan Lye
- Applicant: Finisar Corporation
- Applicant Address: US CA Sunnyvale
- Assignee: FINISAR CORPORATION
- Current Assignee: FINISAR CORPORATION
- Current Assignee Address: US CA Sunnyvale
- Agency: Maschoff Brennan
- Main IPC: H01S5/022
- IPC: H01S5/022 ; H01S5/42 ; G03B21/20 ; H01S5/183

Abstract:
An emitter package can include: a body having a bottom member, side members extending from the bottom member, and a top surface, wherein the body defines a cavity formed into the top surface and located between the bottom member and side members; the cavity having top side walls extending from the top surface to optic shelves, middle side walls extending from the optic shelves to contact shelves, and bottom side walls extending from the contact shelves to a base surface; electrical conductive pads on the base surface in the cavity; emitter chips on the electrical conductive pads, each emitter chip having one or more light emitters; shelf contact pads on the contact shelves; and electrical connector wires connected to and extending between the emitter chips and the shelf contact pads.
Public/Granted literature
- US20190146319A1 HIGH POWER CAVITY PACKAGE FOR LIGHT EMITTERS Public/Granted day:2019-05-16
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