Invention Grant
- Patent Title: Distributed electrostatic discharge protection for an on-package input/output architecture
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Application No.: US15043370Application Date: 2016-02-12
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Publication No.: US10374419B2Publication Date: 2019-08-06
- Inventor: Todd W. Mellinger , Michael E. Griffith , Ganesh Balamurugan , Thomas P. Thomas
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Compass IP Law PC
- Main IPC: H02H9/04
- IPC: H02H9/04 ; H01L27/02 ; H03K19/003 ; G06F1/16

Abstract:
An on-package interface. A first set of single-ended transmitter circuits on a first die. A first set of single-ended receiver circuits on a second die. The receiver circuits have a termination circuit comprising an inverter and a resistive feedback element. A plurality of conductive lines couple the first set of transmitter circuits and the first set of receiver circuits. The lengths of the plurality of conductive lines are matched.
Public/Granted literature
- US20160164281A1 DISTRIBUTED ELECTROSTATIC DISCHARGE PROTECTION FOR AN ON-PACKAGE INPUT/OUTPUT ARCHITECTURE Public/Granted day:2016-06-09
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