A boost circuit compensator module enclosure is provided. The boost circuit compensator module enclosure includes an outer housing and a connection assembly. The outer housing includes a first end and a second end, the first end spaced apart from the second end along a first direction, wherein the second end defines a plane oriented at an angle relative to the first direction, and wherein the outer housing is configured to receive a plurality of boost circuit compensator modules. The connection assembly is coupled to the outer housing proximate the second end and includes at least one row. The at least one row includes a plurality of terminal bases, each terminal base electrically coupleable between a respective boost circuit compensator module and a plurality of transmission lines. Each terminal base includes two conductor receptacles and a longitudinal axis oriented obliquely relative to the plane defined by the second end.