Invention Grant
- Patent Title: Power feeding device and contactless power feeding system provided with power feeding device
-
Application No.: US15850321Application Date: 2017-12-21
-
Publication No.: US10374463B2Publication Date: 2019-08-06
- Inventor: Koichiro Kamata
- Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- Applicant Address: JP Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Kanagawa-ken
- Agency: Nixon Peabody LLP
- Agent Jeffrey L. Costellia
- Priority: JP2010-287380 20101224
- Main IPC: H02J50/12
- IPC: H02J50/12 ; H02J50/90 ; H02J50/80 ; H02J7/02 ; H02J50/40 ; H01F38/14 ; H02J5/00 ; H02J17/00 ; H01F27/00

Abstract:
A power feeding device utilizing an electromagnetic resonance coupling method and a contactless power feeding system can be provided. A coupling coefficient of electromagnetic induction coupling in the power feeding device and/or the inside of a power receiving device is optimized to improve electric power transmission efficiency of a resonance frequency regardless of positions of the power feeding device and the power receiving device. Provided is a power feeding device or a contactless power feeding system in which an S11 parameter which is a reflection component of electric power output from a high-frequency power source of the power feeding device is monitored, and one or both of positions of a transmission coil and a first resonant coil in the power feeding device and positions of a reception coil and a second resonant coil in a power receiving device are changed to adjust a coupling coefficient of electromagnetic induction coupling.
Public/Granted literature
- US20180115194A1 POWER FEEDING DEVICE AND CONTACTLESS POWER FEEDING SYSTEM PROVIDED WITH POWER FEEDING DEVICE Public/Granted day:2018-04-26
Information query