Invention Grant
- Patent Title: Microwave transmitter with improved information throughput
-
Application No.: US15624468Application Date: 2017-06-15
-
Publication No.: US10374553B2Publication Date: 2019-08-06
- Inventor: Felix Ejeckam , Tyrone D Mitchell, Jr. , Paul Saunier
- Applicant: Akash Systems, Inc.
- Applicant Address: US CA San Francisco
- Assignee: Akash Systems, Inc.
- Current Assignee: Akash Systems, Inc.
- Current Assignee Address: US CA San Francisco
- Agency: Wilson Sonsini Goodrich & Rosati
- Main IPC: H01L29/778
- IPC: H01L29/778 ; H03F1/02 ; H03F3/195 ; H03F3/213 ; H01L23/66 ; H03F3/24 ; H01L29/20
Abstract:
An RF amplifier module comprises a package having a package base, at least one RF amplifier chip attached to the package base, and an RF power combiner chip attached to the package base. The RF amplifier chip comprises a substrate and at least one transistor disposed on an epilayer overlying the substrate. The substrate comprises a first layer of synthetic diamond characterized by an average value of thermal conductivity.An RF amplifier module comprises a package having a package base, at least one RF amplifier chip attached to the package base, and an RF power combiner chip attached to the package base. The RF amplifier chip comprises a substrate and at least one transistor disposed on an epilayer overlying the substrate. A first layer of synthetic diamond is at least partially disposed on top of the electronic device.
Public/Granted literature
- US20180367100A1 Microwave transmitter with improved information throughput Public/Granted day:2018-12-20
Information query
IPC分类:
