Invention Grant
- Patent Title: Microwave heating apparatus
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Application No.: US14430598Application Date: 2013-09-24
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Publication No.: US10375773B2Publication Date: 2019-08-06
- Inventor: Hiroshi Uchida , Kazuaki Senda , Mutsumi Yoshida
- Applicant: SHOWA DENKO K.K.
- Applicant Address: JP Minato-ku, Tokyo
- Assignee: SHOWA DENKO K.K.
- Current Assignee: SHOWA DENKO K.K.
- Current Assignee Address: JP Minato-ku, Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2012-211432 20120925
- International Application: PCT/JP2013/075738 WO 20130924
- International Announcement: WO2014/050828 WO 20140403
- Main IPC: H05B6/70
- IPC: H05B6/70 ; H05B6/78

Abstract:
Provided is a microwave heating apparatus capable of effectively preventing the generation of sparks when an object containing a conductor (including a metal precursor such as a metal oxide) or a semiconductor is subjected to microwave heating. A microwave heating apparatus supplies a microwave so that the direction of the electrical flux line of the microwave is identical with the direction substantially parallel with a surface of a plate-like substrate and having thereon a pattern containing a conductor, a metal oxide, or a semiconductor, the substrate being arranged in the waveguide. The microwave heating apparatus also controls a pulse width of the microwave so that pulsed microwaves are supplied to the surface having the pattern thereon.
Public/Granted literature
- US20150223295A1 MICROWAVE HEATING APPARATUS Public/Granted day:2015-08-06
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