- Patent Title: Differential signal traces including a solder mask disposed thereon
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Application No.: US15578574Application Date: 2016-06-01
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Publication No.: US10375823B2Publication Date: 2019-08-06
- Inventor: Benjamin Reed Staudt
- Applicant: FCI USA LLC
- Applicant Address: US PA Etters
- Assignee: FCI USA LLC
- Current Assignee: FCI USA LLC
- Current Assignee Address: US PA Etters
- Agency: Wolf, Greenfield & Sacks, P.C.
- International Application: PCT/US2016/035158 WO 20160601
- International Announcement: WO2016/196551 WO 20161208
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H01P11/00 ; H01L23/498 ; H01P3/08 ; H05K3/10 ; H05K3/28 ; H05K3/34
Abstract:
Disclosed herein is a method. A first electrically conductive trace is provided on a substrate. A second electrically conductive trace is providing on the substrate proximate the first electrically conductive trace. A solder mask is provided at the first and the second electrically conductive traces. A portion of the first electrically conductive trace is free of any portion of the solder mask covering thereon.
Public/Granted literature
- US20180139839A1 DIFFERENTIAL SIGNAL TRACES Public/Granted day:2018-05-17
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