Invention Grant
- Patent Title: Power module substrate, power module substrate with heat sink, power module, method of manufacturing power module substrate, and copper member-bonding paste
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Application No.: US15289453Application Date: 2016-10-10
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Publication No.: US10375825B2Publication Date: 2019-08-06
- Inventor: Nobuyuki Terasaki , Yoshiyuki Nagatomo , Kimihito Nishikawa , Yoshirou Kuromitsu
- Applicant: MITSUBISHI MATERIALS CORPORATION
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI MATERIALS CORPORATION
- Current Assignee: MITSUBISHI MATERIALS CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Locke Lord LLP
- Priority: JP2012-020171 20120201; JP2012-020172 20120201; JP2012-267298 20121206; JP2012-267299 20121206
- Main IPC: H05K1/02
- IPC: H05K1/02 ; B23K35/02 ; B23K35/30 ; B23K35/32 ; C22C5/06 ; C22C14/00 ; C22C16/00 ; C22C21/00 ; C22C27/00 ; C22C27/02 ; C22C28/00 ; C22F1/08 ; H01L23/373 ; B23K1/00 ; B23K35/36 ; H05K1/03 ; H05K1/09 ; H05K1/18 ; H05K3/38 ; H05K13/04 ; C04B37/02 ; C04B35/632 ; B23K35/26 ; B23K35/365 ; C22C30/04 ; G01B15/02 ; G01N23/203 ; B23K101/42
Abstract:
This power module substrate includes a copper plate that is formed of copper or a copper alloy and is laminated on a surface of a ceramic substrate 11; a nitride layer 31 that is formed on the surface of the ceramic substrate 11 between the copper plate and the ceramic substrate 11; and an Ag—Cu eutectic structure layer 32 having a thickness of 15 μm or less that is formed between the nitride layer and the copper plate.
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