Invention Grant
- Patent Title: Housing having housing parts bondable together and method of manufacturing the same
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Application No.: US15723376Application Date: 2017-10-03
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Publication No.: US10375846B2Publication Date: 2019-08-06
- Inventor: Ya-Tung I , Chien-Hua Chu
- Applicant: LITE-ON ELECTRONICS (GUANGZHOU) LIMITED , LITE-ON TECHNOLOGY CORP.
- Applicant Address: CN Guangzhou TW Taipei
- Assignee: Lite-On Electronics (Guangzhou) Limited,Lite-On Technology Corp.
- Current Assignee: Lite-On Electronics (Guangzhou) Limited,Lite-On Technology Corp.
- Current Assignee Address: CN Guangzhou TW Taipei
- Agency: Rosenberg, Klein & Lee
- Priority: CN201710025910 20170113
- Main IPC: H05K5/02
- IPC: H05K5/02 ; H05K5/06 ; B23K20/10 ; B29C65/08 ; B29C65/00 ; B29L31/34 ; B23K101/04 ; B23K101/36

Abstract:
A housing includes a first surrounding wall connected around a base wall. The first surrounding wall has a first joint portion opposite to the base wall, a first outer surface and a first inner surface. The first outer and inner surfaces extend from the first joint portion toward the base wall. The first joint portion is stepped and has a first projecting portion adjoining the first outer surface, and a first shoulder portion indented from the first projecting portion and proximal to the first inner surface. The first shoulder portion has a plurality of parallel spaced-apart ribs protruding therefrom in a same direction as the first projecting portion. Each of the ribs has a tip that does not extend beyond a top end of the first projecting portion.
Public/Granted literature
- US20180206349A1 HOUSING HAVING HOUSING PARTS BONDABLE TOGETHER AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2018-07-19
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