A cut-and-clinch apparatus that cuts and bends protruding parts of two lead wires of a lead component to be respectively inserted through two of a plurality of through-holes formed in a circuit board, the cut-and-clinch apparatus includes a pair of movable elements that are used in a case where the respective protruding parts of the two lead wires are cut and bent and that are made to approach each other and separate from each other, and a movable element position control section that controls the positions of the pair of movable elements, on the basis of image data obtained by the pair of movable elements being imaged.