Invention Grant
- Patent Title: Coil component and coil-component-equipped mounting substrate
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Application No.: US16110915Application Date: 2018-08-23
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Publication No.: US10381152B2Publication Date: 2019-08-13
- Inventor: Ryota Hashimoto
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto-fu
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto-fu
- Agency: Studebaker & Brackett PC
- Priority: JP2017-164099 20170829
- Main IPC: H01F27/29
- IPC: H01F27/29 ; H01F27/28 ; H01F27/24 ; H05K1/18 ; H05K1/02 ; H01F17/04 ; H05K3/34

Abstract:
A coil component has an outer electrode include a bottom-surface electrode portion disposed along a bottom surface of a component body and an end-surface electrode portion disposed along an end surface of the component body so as to be continuous with the bottom-surface electrode portion. The adhesive strength of the bottom-surface electrode portion with respect to the component body is lower than that of the end-surface electrode portion with respect to the component body.
Public/Granted literature
- US20190066911A1 COIL COMPONENT AND COIL-COMPONENT-EQUIPPED MOUNTING SUBSTRATE Public/Granted day:2019-02-28
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