Invention Grant
- Patent Title: Multilayer composite bonding materials and power electronics assemblies incorporating the same
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Application No.: US15824573Application Date: 2017-11-28
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Publication No.: US10381223B2Publication Date: 2019-08-13
- Inventor: Shailesh N. Joshi
- Applicant: Toyota Motor Engineering & Manufacturing North America, Inc.
- Applicant Address: US TX Plano
- Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.
- Current Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.
- Current Assignee Address: US TX Plano
- Agency: Dinsmore & Shohl LLP
- Main IPC: H01L21/20
- IPC: H01L21/20 ; H01L21/324
Abstract:
A multilayer composite bonding material for transient liquid phase bonding a semiconductor device to a metal substrate includes thermal stress compensation layers sandwiched between a pair of bonding layers. The thermal stress compensation layers may include a core layer with a first stiffness sandwiched between a pair of outer layers with a second stiffness that is different than the first stiffness such that a graded stiffness extends across a thickness of the thermal stress compensation layers. The thermal stress compensation layers have a melting point above a sintering temperature and the bonding layers have a melting point below the sintering temperature. The graded stiffness across the thickness of the thermal stress compensation layers compensates for thermal contraction mismatch between the semiconductor device and the metal substrate during cooling from the sintering temperature to ambient temperature.
Public/Granted literature
- US20190164760A1 MULTILAYER COMPOSITE BONDING MATERIALS AND POWER ELECTRONICS ASSEMBLIES INCORPORATING THE SAME Public/Granted day:2019-05-30
Information query
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