An alternating stack of insulating layers and spacer material layers is formed over a substrate. The spacer material layers are formed as, or are replaced with, electrically conductive layers. An insulating cap layer is formed over the alternating stack. After formation of memory stack structures through each layer of the alternating stack and the insulating cap layer, a line trench straddling a neighboring pair of rows of the memory stack is formed. Sidewalls of the line trench include a sidewall of each memory stack structure within the neighboring pair of rows of the memory stack structures. A drain select gate dielectric and a drain select electrode line are formed within the line trench. The drain select electrode line controls flow of electrical current through an upper portion of a vertical semiconductor channel within each memory stack structure below the drain regions to activate or deactivate the neighboring rows.