Invention Grant
- Patent Title: Testing method of packaging process and packaging structure
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Application No.: US15705250Application Date: 2017-09-14
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Publication No.: US10381278B2Publication Date: 2019-08-13
- Inventor: Hung-Hsin Hsu , Shang-Yu Chang Chien , Nan-Chun Lin
- Applicant: Powertech Technology Inc.
- Applicant Address: TW Hsinchu
- Assignee: Powertech Technology Inc.
- Current Assignee: Powertech Technology Inc.
- Current Assignee Address: TW Hsinchu
- Agency: JCIPRNET
- Main IPC: H01L21/26
- IPC: H01L21/26 ; G01R31/02 ; G01R31/28 ; H01L23/00 ; H01L21/66
Abstract:
A testing method of a packaging process includes following steps. A substrate is provided. A circuit structure is formed on the substrate. The circuit structure includes a real unit area and a dummy side rail surrounding the real unit area, and a plurality of first circuit patterns is disposed on the real unit area. A second circuit pattern is formed on the dummy side rail, and the second circuit pattern emulates the configurations of at least a portion of the first circuit patterns for operating a simulation test. In addition, a packaging structure adapted for a testing process is also mentioned.
Public/Granted literature
- US20190080971A1 TESTING METHOD OF PACKAGING PROCESS AND PACKAGING STRUCTURE Public/Granted day:2019-03-14
Information query
IPC分类:
