Invention Grant
- Patent Title: Lead frame and method of manufacturing lead frame
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Application No.: US16106460Application Date: 2018-08-21
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Publication No.: US10381292B2Publication Date: 2019-08-13
- Inventor: Koji Watanabe , Kentaro Kaneko
- Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.
- Applicant Address: JP Nagano
- Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
- Current Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
- Current Assignee Address: JP Nagano
- Agency: IPUSA, PLLC
- Priority: JP2017-171314 20170906
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/00 ; H01L21/48 ; H01L21/56

Abstract:
A lead frame includes a plate portion provided with a first surface and a second surface, the second surface being opposite to the first surface; a protruding portion integrally formed with the plate portion to be protruded from the first surface of the plate portion, wherein a surface of the lead frame includes a work affected layer existing region at which a work affected layer is formed, and a work affected layer non-existing region at which a work affected layer is not formed, wherein a front end surface of the protruding portion is the work affected layer existing region, wherein a region of the first surface at which the protruding portion is not formed is the work affected layer non-existing region, and wherein the second surface of the plate portion includes the work affected layer non-existing region.
Public/Granted literature
- US20190074242A1 LEAD FRAME AND METHOD OF MANUFACTURING LEAD FRAME Public/Granted day:2019-03-07
Information query
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