Invention Grant
- Patent Title: Metal fill optimization for self-aligned double patterning
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Application No.: US15604090Application Date: 2017-05-24
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Publication No.: US10381338B2Publication Date: 2019-08-13
- Inventor: Albert M. Chu , Lawrence A. Clevenger , Ximeng Guan , Myung-Hee Na
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Cantor Colburn LLP
- Agent Vazken Alexanian
- Main IPC: H01L27/02
- IPC: H01L27/02 ; H01L23/522

Abstract:
A technique relates to a method of optimizing self-aligned double patterning. Predefined locations for required metal cuts are provided in order to form metal wires from metal fills that have been cut. Extended locations for extended metal cuts are provided in order to cut adjacent metal fills. The adjacent metal fills are the metal fills that are adjacent to the predefined locations for the required metal cuts, and the extended metal cuts extend beyond the required metal cuts. The required metal cuts into the metal fills are performed and the extended metal cuts into the adjacent metal fills are performed.
Public/Granted literature
- US20180082854A1 METAL FILL OPTIMIZATION FOR SELF-ALIGNED DOUBLE PATTERNING Public/Granted day:2018-03-22
Information query
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