Invention Grant
- Patent Title: Semiconductor device
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Application No.: US15788353Application Date: 2017-10-19
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Publication No.: US10381451B2Publication Date: 2019-08-13
- Inventor: Fujio Masuoka , Hiroki Nakamura
- Applicant: Unisantis Electronics Singapore Pte. Ltd.
- Applicant Address: SG Singapore
- Assignee: UNISANTIS ELECTRONICS SINGAPORE PTE. LTD.
- Current Assignee: UNISANTIS ELECTRONICS SINGAPORE PTE. LTD.
- Current Assignee Address: SG Singapore
- Agency: Brinks Gilson & Lione
- Main IPC: H01L29/423
- IPC: H01L29/423 ; H01L29/78 ; H01L29/66 ; H01L29/778 ; H01L29/49 ; H01L29/786

Abstract:
A semiconductor device includes a pillar-shaped semiconductor layer formed on a substrate; a first insulator surrounding the pillar-shaped semiconductor layer; a first gate surrounding the first insulator and made of a metal having a first work function; a second gate surrounding the first insulator and made of a metal having a second work function different from the first work function, the second gate being located below the first gate; a third gate surrounding the first insulator and made of a metal having the first work function, the third gate being located below the second gate; and a fourth gate surrounding the first insulator and made of a metal having the second work function different from the first work function, the fourth gate being located below the third gate. The first gate, the second gate, the third gate, and the fourth gate are electrically connected together.
Public/Granted literature
- US20180047823A1 SEMICONDUCTOR DEVICE Public/Granted day:2018-02-15
Information query
IPC分类: