Invention Grant
- Patent Title: Method and system for engineering the secondary barrier layer in dual magnetic junctions
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Application No.: US15968471Application Date: 2018-05-01
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Publication No.: US10381550B1Publication Date: 2019-08-13
- Inventor: Zheng Duan , Dmytro Apalkov , Vladimir Nikitin
- Applicant: Samsung Electronics Co., LTD.
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Van Pelt, Yi & James LLP
- Main IPC: H01L43/02
- IPC: H01L43/02 ; H01L43/12 ; H01L43/08 ; H01L27/22 ; H01L43/10

Abstract:
A magnetic junction, a memory using the magnetic junction and method for providing the magnetic junction are described. The magnetic junction includes first and second reference layers, a main barrier layer having a first thickness, a free layer, an engineered secondary barrier layer and a second reference layer. The free layer is switchable between stable magnetic states when a write current is passed through the magnetic junction. The main barrier layer is between the first reference layer and the free layer. The secondary barrier layer is between the free layer and the second reference layer. The engineered secondary barrier layer has a resistance, a second thickness less than the first thickness and a plurality of regions having a reduced resistance less than the resistance. The free and reference layers each has a perpendicular magnetic anisotropy energy and an out-of-plane demagnetization energy less than the perpendicular magnetic anisotropy energy.
Public/Granted literature
- US20190273201A1 METHOD AND SYSTEM FOR ENGINEERING THE SECONDARY BARRIER LAYER IN DUAL MAGNETIC JUNCTIONS Public/Granted day:2019-09-05
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