Invention Grant
- Patent Title: Method and apparatus for cooling of an electronic device
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Application No.: US15981931Application Date: 2018-05-17
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Publication No.: US10381562B1Publication Date: 2019-08-13
- Inventor: Jorge Luis Rosales , Victor Chiriac , Sean Charles Andrews
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Qualcomm Incorporated
- Main IPC: H01L45/00
- IPC: H01L45/00

Abstract:
Some features pertain to an apparatus that includes a first heat spreader and a second heat spreader, a matrixed heat spreader, the matrixed heat spreader including a first plurality of portions perpendicular to a second plurality of portions, the first plurality of portions intersects the second plurality of portions, and a phase change material (PCM) located in a plurality of reservoirs defined by the matrixed heat spreader.
Information query
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