Invention Grant
- Patent Title: Ground connection structure
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Application No.: US14335280Application Date: 2014-07-18
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Publication No.: US10381793B2Publication Date: 2019-08-13
- Inventor: Yukinari Naganishi , Akira Baba , Takashi Odajima , Hirohito Habara , Hideaki Saitoh , Takao Ota , Akihiro Koyama , Atsushi Nakata
- Applicant: Yazaki Corporation
- Applicant Address: JP Minato-ku, Tokyo
- Assignee: YAZAKI CORPORATION
- Current Assignee: YAZAKI CORPORATION
- Current Assignee Address: JP Minato-ku, Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2012-009739 20120120
- Main IPC: B60L50/50
- IPC: B60L50/50 ; H01R43/00 ; H01R4/64 ; H01R11/32 ; H01B5/12 ; H01R11/12 ; H01R4/02 ; H01R4/30

Abstract:
A ground connection structure is a structure for collectively connecting, to a body of a vehicle, a plurality of grounding wires which are connected to respective electrical components installed in the vehicle. The ground connection structure includes: a connection box to which the plurality of grounding wires are connected; a grounding terminal part connected to the vehicle in an electrically conducting state; and an electrically conducting connection part having one end connected to the connection box and the other end connected to the grounding terminal part, the electrically conducting connection part connecting the connection box and the grounding terminal part in an electrically conducting manner. The electrically conducting connection part is made of a low-inductance material having low inductance.
Public/Granted literature
- US20140327303A1 GROUND CONNECTION STRUCTURE Public/Granted day:2014-11-06
Information query
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