Invention Grant
- Patent Title: Amplifiers and amplifier modules with shunt inductance circuits that include high-Q capacitors
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Application No.: US15846162Application Date: 2017-12-18
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Publication No.: US10381984B2Publication Date: 2019-08-13
- Inventor: Yu-Ting David Wu , Enver Krvavac , Joseph Gerard Schultz , Nick Yang , Damon G. Holmes , Shishir Ramasare Shukla , Jeffrey Kevin Jones , Elie A. Maalouf , Mario Bokatius
- Applicant: NXP USA, Inc.
- Applicant Address: US TX Austin
- Assignee: NXP USA, Inc.
- Current Assignee: NXP USA, Inc.
- Current Assignee Address: US TX Austin
- Agent Sherry W. Schumm
- Main IPC: H03F3/68
- IPC: H03F3/68 ; H03F1/02 ; H01L27/06 ; H01L23/66 ; H03F3/195 ; H03F1/56 ; H03F3/213 ; H01L27/085

Abstract:
A Doherty amplifier module includes first and second amplifier die. The first amplifier die includes one or more first power transistors configured to amplify, along a first signal path, a first input RF signal to produce an amplified first RF signal. The second amplifier die includes one or more second power transistors configured to amplify, along a second signal path, a second input RF signal to produce an amplified second RF signal. A phase shift and impedance inversion element is coupled between the outputs of the first and second amplifier die. A shunt circuit is coupled to the output of either or both of the first and/or second amplifier die. The shunt circuit includes a series coupled inductance and high-Q capacitor (e.g., a metal-insulator-metal (MIM) capacitor), and the shunt circuit is configured to at least partially resonate out the output capacitance of the amplifier die to which it is connected.
Public/Granted literature
- US20180175802A1 AMPLIFIERS AND AMPLIFIER MODULES WITH SHUNT INDUCTANCE CIRCUITS THAT INCLUDE HIGH-Q CAPACITORS Public/Granted day:2018-06-21
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