Invention Grant
- Patent Title: Flexible circuit board
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Application No.: US16169918Application Date: 2018-10-24
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Publication No.: US10383221B1Publication Date: 2019-08-13
- Inventor: Ryohsuke Sugiyama , Takayuki Yanagi
- Applicant: SHARP KABUSHIKI KAISHA
- Applicant Address: JP Sakai, Osaka
- Assignee: SHARP KABUSHIKI KAISHA
- Current Assignee: SHARP KABUSHIKI KAISHA
- Current Assignee Address: JP Sakai, Osaka
- Agency: ScienBiziP, P.C.
- Priority: JP2018-025208 20180215
- Main IPC: H01R12/59
- IPC: H01R12/59 ; H05K1/03 ; H05K1/11 ; H05K1/02

Abstract:
An aspect of the present invention makes it possible to reduce stress at a boundary between a coverlay and a terminal section of a flexible circuit board and reduce the possibility of disconnection in the terminal section in the flexible circuit board. An aspect of the present invention provides a flexible circuit board including: a reinforcing plate bonded to a whole of a terminal section and a portion of a coverlay; and a flexible plate including a holding portion and a bonding portion, the flexible plate bonding to the coverlay via only the bonding portion, the flexible plate being spaced apart from the reinforcing plate.
Public/Granted literature
- US20190254163A1 FLEXIBLE CIRCUIT BOARD Public/Granted day:2019-08-15
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